ХС/КН код 38180011 е извън обхват за подготовка по EUDR.
Doped silicon wafers of a thickness <=200μm, rectangular, whether or not with cut or rounded corners "photovoltaic wafers" Индексираният двигател за обхват връща Out of scope за този код. No Annex I scope match was found for this indexed CN code.
Защо тази справочна страница дава този отговор.
- Описание на кода
- Doped silicon wafers of a thickness <=200μm, rectangular, whether or not with cut or rounded corners "photovoltaic wafers"
- Основание в Приложение I
- Няма пряк запис в Приложение I
- Основание от източника
- Regulation (EU) 2023/1115 Annex I and CN 2026 index
Родителски, дъщерни и близки редове.
Изгледът в библиотеката е за справочна навигация. Използвайте проверката, когато искате да изпълните друг код като действие.
38различни видове продукти на химическата промишленостnarrower3818chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion)out381800chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion)out38180010silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion)out38180019silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and "photovoltaic" rectangular wafers of a thickness <=200μm)out38180090chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon)out
Какво означава това за подготовката.
Този ред не е пряк спусък за събиране на доказателства в текущия резултат за обхвата.
Regulation (EU) 2023/1115 Annex I — relevant productsизвлечено на 2026-08-06Commission Delegated Regulation (EU) 2026/2102 amending Annex I to Regulation (EU) 2023/1115извлечено на 2026-09-24Eurostat Comext Combined Nomenclature codelist (CXT_NC v11.0)извлечено на 2026-08-06Eurostat Comext partner country codelist (CXT_FREE_ISO)извлечено на 2026-08-06Eurostat Comext DS-045409 — EU trade since 1988 by HS2-4-6 and CN8извлечено на 2026-08-06Commission Implementing Regulation (EU) 2025/1093 — country benchmarkingизвлечено на 2026-08-06Regulation (EU) 2025/2650 amending Regulation (EU) 2023/1115 as regards certain obligations of operators and tradersизвлечено на 2025-12-26Commission Implementing Regulation (EU) 2026/1565 amending Implementing Regulation (EU) 2024/3084 (EUDR information system)извлечено на 2026-08-08