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Библиотека за обхват по ХС/КН
Справочник за кодядрени реактори, котли, машини, апарати и механизми; части за тези машини или апарати

Machine tools for working any material by removal of material, operated by electro-chemical processes or electron beam, ion beam or plasma arc processes (excl. for soldering and welding machines, materials testing machines and apparatus for-dry etching semiconductor materials)

Датиран по източник справочник за ХС/КН код 845699, основанието му за обхват по EUDR, йерархията в КН, последиците за доказателствата и свързаните индексирани редове.

Вид справкаСправочен запис за обхват по ХС/КН
Решение за обхватаOut of scope
Последица за вносителяСамо справочна бележка
Година на КН2026
Справочен отговор

ХС/КН код 845699 е извън обхват за подготовка по EUDR.

Machine tools for working any material by removal of material, operated by electro-chemical processes or electron beam, ion beam or plasma arc processes (excl. for soldering and welding machines, materials testing machines and apparatus for-dry etching semiconductor materials) Индексираният двигател за обхват връща Out of scope за този код. No Annex I scope match was found for this indexed CN code.

Основание за обхвата

Защо тази справочна страница дава този отговор.

Описание на кода
Machine tools for working any material by removal of material, operated by electro-chemical processes or electron beam, ion beam or plasma arc processes (excl. for soldering and welding machines, materials testing machines and apparatus for-dry etching semiconductor materials)
Основание в Приложение I
Няма пряк запис в Приложение I
Основание от източника
Regulation (EU) 2023/1115 Annex I and CN 2026 index
Йерархия на КН

Родителски, дъщерни и близки редове.

Изгледът в библиотеката е за справочна навигация. Използвайте проверката, когато искате да изпълните друг код като действие.

84ядрени реактори, котли, машини, апарати и механизми; части за тези машини или апаратиout8456machine tools for working any material by removal of material, by laser or other light or photon beam, ultrasonic, electro-discharge, electro-chemical, electron beam, ionic-beam or plasma arc processes; water-jet cutting machines (excl. cleaning apparatus operated by ultrasonic processes, soldering and welding machines, incl. those which can be used for cutting, and material testing machines)out84569910focused ion beam milling machines for producing or repairing masks and reticles for patterns on semiconductor devicesout84569930machine tools for stripping or cleaning semiconductor wafers by electro-chemical processes or electron beam, ion beam or plasma arc processesout84569950machine tools for dry-etching patterns on lcd substrates by electro-chemical processes or electron beam, ion beam or plasma arc processesout84569980machine tools for working any material by removal of material, operated by electro-chemical processes or electron beam, ion beam or plasma arc processes (excl. for soldering and welding machines, materials testing machines, focused ion beam milling machines for producing or repairing masks and reticles for patterns on semiconductor devices, machine tools for dry-etching patterns on semiconductor materials and on lcd substrates, and apparatus for stripping or cleaning semiconductor wafers)out84569990machine-tools for working any material by removal of any material by electro-chemical processes or electron beam, ion beam or plasma arc processes (excl. for soldering and welding machines, materials testing machines, focused ion beam milling machines for producing or repairing masks and reticles for patterns on semiconductor devices, machine-tools for dry- etching patterns on semi-conductor materials and apparatus for stripping or cleaning semiconductor wafers)out845610machine tools for working any material by removal of material, operated by laser or other light or photon beam processes (excl. soldering and welding machines, incl. those which can be used for cutting, material testing machines and machines for the manufacture of semiconductor devices or of electronic integrated circuits)out845611machine tools for working any material by removal of material, operated by laser (excl. soldering and welding machines, also those which can be used for cutting, material testing machines and machines for the manufacture of semiconductor devices or of electronic integrated circuits)out845612machine tools for working any material by removal of material, operated by light or photon beam processes other than laser (excl. soldering and welding machines, also those which can be used for cutting, material testing machines and machines for the manufacture of semiconductor devices or of electronic integrated circuits)out845620machine tools for working any material by removal of material, operated by ultrasonic processes (excl. cleaning apparatus operated by ultrasonic processes and material testing machines)out845630machine tools for working any material by removal of material, operated by electro-discharge processesout845640machine tools for working any material by removal of material, operated by plasma arc processesout
Модел на доказателствата

Какво означава това за подготовката.

Този ред не е пряк спусък за събиране на доказателства в текущия резултат за обхвата.

Метаданни на източника
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Отворете резултата от инструмента
845699 — справочник за обхват по ХС/КН на EUDR | EUDR Tools