HS/KN-kode 38180011 er ikke omfattet til EUDR-forberedelse.
Doped silicon wafers of a thickness <=200μm, rectangular, whether or not with cut or rounded corners "photovoltaic wafers" Den indekserede anvendelsesområde-motor returnerer Out of scope for denne kode. No Annex I scope match was found for this indexed CN code.
Hvorfor denne referenceside giver dette svar.
- Kodebeskrivelse
- Doped silicon wafers of a thickness <=200μm, rectangular, whether or not with cut or rounded corners "photovoltaic wafers"
- Bilag I-grundlag
- Ingen direkte bilag I-post
- Kildegrundlag
- Regulation (EU) 2023/1115 Annex I and CN 2026 index
Overordnet, underordnet og nærliggende rækker.
Biblioteksvisningen er til referencenavigation. Brug tjekkeren, når du vil køre en anden kode som en handling.
38diverse kemiske produkternarrower3818chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion)out381800chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion)out38180010silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion)out38180019silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and "photovoltaic" rectangular wafers of a thickness <=200μm)out38180090chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon)out
Hvad dette betyder for forberedelsen.
Denne række udløser ikke direkte indsamling af dokumentation i det aktuelle anvendelsesområde-resultat.
Regulation (EU) 2023/1115 Annex I — relevant productshentet 2026-08-06Commission Delegated Regulation (EU) 2026/2102 amending Annex I to Regulation (EU) 2023/1115hentet 2026-09-24Eurostat Comext Combined Nomenclature codelist (CXT_NC v11.0)hentet 2026-08-06Eurostat Comext partner country codelist (CXT_FREE_ISO)hentet 2026-08-06Eurostat Comext DS-045409 — EU trade since 1988 by HS2-4-6 and CN8hentet 2026-08-06Commission Implementing Regulation (EU) 2025/1093 — country benchmarkinghentet 2026-08-06Regulation (EU) 2025/2650 amending Regulation (EU) 2023/1115 as regards certain obligations of operators and tradershentet 2025-12-26Commission Implementing Regulation (EU) 2026/1565 amending Implementing Regulation (EU) 2024/3084 (EUDR information system)hentet 2026-08-08