HS/KN-kode 84561090 er ikke omfattet til EUDR-forberedelse.
Machine tools for working any material by removal of material, operated by laser or other light or photon beam processes (excl. those of a kind used in the manufacture of semiconductor wafers or devices, soldering and welding machines, incl. those which can be used for cutting, and material testing machines) Den indekserede anvendelsesområde-motor returnerer Out of scope for denne kode. No Annex I scope match was found for this indexed CN code.
Hvorfor denne referenceside giver dette svar.
- Kodebeskrivelse
- Machine tools for working any material by removal of material, operated by laser or other light or photon beam processes (excl. those of a kind used in the manufacture of semiconductor wafers or devices, soldering and welding machines, incl. those which can be used for cutting, and material testing machines)
- Bilag I-grundlag
- Ingen direkte bilag I-post
- Kildegrundlag
- Regulation (EU) 2023/1115 Annex I and CN 2026 index
Overordnet, underordnet og nærliggende rækker.
Biblioteksvisningen er til referencenavigation. Brug tjekkeren, når du vil køre en anden kode som en handling.
84atomreaktorer; kedler; maskiner og apparater samt mekaniske redskaber; dele dertilout8456machine tools for working any material by removal of material, by laser or other light or photon beam, ultrasonic, electro-discharge, electro-chemical, electron beam, ionic-beam or plasma arc processes; water-jet cutting machines (excl. cleaning apparatus operated by ultrasonic processes, soldering and welding machines, incl. those which can be used for cutting, and material testing machines)out845610machine tools for working any material by removal of material, operated by laser or other light or photon beam processes (excl. soldering and welding machines, incl. those which can be used for cutting, material testing machines and machines for the manufacture of semiconductor devices or of electronic integrated circuits)out84561000machine tools for working any material by removal of material, operated by laser or other light or photon beam processes (excl. soldering and welding machines, incl. those which can be used for cutting, material testing machines and machines for the manufacture of semiconductor devices or of electronic integrated circuits)(2007-2016);machine-tools for working any material by removal of material, operated by laser or other light or photon beam processes (excl. soldering and welding machines, incl. those which can be used for cutting, and material testing machines)(1988-1997)out84561010machine tools for working any material by removal of material, operated by laser or other light or photon beam processes, of a kind used in the manufacture of semiconductor wafers or devicesout
Hvad dette betyder for forberedelsen.
Denne række udløser ikke direkte indsamling af dokumentation i det aktuelle anvendelsesområde-resultat.
Regulation (EU) 2023/1115 Annex I — relevant productshentet 2026-08-06Commission Delegated Regulation (EU) 2026/2102 amending Annex I to Regulation (EU) 2023/1115hentet 2026-09-24Eurostat Comext Combined Nomenclature codelist (CXT_NC v11.0)hentet 2026-08-06Eurostat Comext partner country codelist (CXT_FREE_ISO)hentet 2026-08-06Eurostat Comext DS-045409 — EU trade since 1988 by HS2-4-6 and CN8hentet 2026-08-06Commission Implementing Regulation (EU) 2025/1093 — country benchmarkinghentet 2026-08-06Regulation (EU) 2025/2650 amending Regulation (EU) 2023/1115 as regards certain obligations of operators and tradershentet 2025-12-26Commission Implementing Regulation (EU) 2026/1565 amending Implementing Regulation (EU) 2024/3084 (EUDR information system)hentet 2026-08-08