Parts and accessories for machines and apparatus of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devices, electronic integrated circuits or flat panel displays, and for machines and apparatus specified in note 9 C to chapter 84, n.e.s. (excl. tool holders, self-opening dieheads, workholders, those of spinners for coating photographic emulsions, for physical deposition by sputtering, for dry-etching patterns, for chemical vapour deposition, on liquid crystal devices "LCD" substrates, of deflash machines for cleaning the metal leads of semiconductor packages prior to the electroplating and for machine-tools operated by ultrasonic processes)

HS/KN-kode 84869090 er ikke omfattet til EUDR-forberedelse.

Parts and accessories for machines and apparatus of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devices, electronic integrated circuits or flat panel displays, and for machines and apparatus specified in note 9 C to chapter 84, n.e.s. (excl. tool holders, self-opening dieheads, workholders, those of spinners for coating photographic emulsions, for physical deposition by sputtering, for dry-etching patterns, for chemical vapour deposition, on liquid crystal devices "LCD" substrates, of deflash machines for cleaning the metal leads of semiconductor packages prior to the electroplating and for machine-tools operated by ultrasonic processes) Den indekserede anvendelsesområde-motor returnerer Out of scope for denne kode. No Annex I scope match was found for this indexed CN code.

Hvorfor denne referenceside giver dette svar.

Kodebeskrivelse

Parts and accessories for machines and apparatus of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devices, electronic integrated circuits or flat panel displays, and for machines and apparatus specified in note 9 C to chapter 84, n.e.s. (excl. tool holders, self-opening dieheads, workholders, those of spinners for coating photographic emulsions, for physical deposition by sputtering, for dry-etching patterns, for chemical vapour deposition, on liquid crystal devices "LCD" substrates, of deflash machines for cleaning the metal leads of semiconductor packages prior to the electroplating and for machine-tools operated by ultrasonic processes)

Bilag I-grundlag

Ingen direkte bilag I-post

Kildegrundlag

Regulation (EU) 2023/1115 Annex I and CN 2026 index

Overordnet, underordnet og nærliggende rækker.

Biblioteksvisningen er til referencenavigation. Brug tjekkeren, når du vil køre en anden kode som en handling.

Hvad dette betyder for forberedelsen.

Denne række udløser ikke direkte indsamling af dokumentation i det aktuelle anvendelsesområde-resultat.