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HS-/KN-Geltungsbereichs-Bibliothek
Code-Referenzkernreaktoren, kessel, maschinen, apparate und mechanische geräte; teile davon

Focused ion beam milling machines for producing or repairing masks and reticles for patterns on semiconductor devices

Quellendatierte Referenz für den HS-/KN-Code 84569010: EUDR-Geltungsbereichsgrundlage, KN-Hierarchie, Auswirkungen auf die Nachweise und verwandte indexierte Zeilen.

ReferenztypHS-/KN-Geltungsbereichseintrag
Geltungsbereichs-EntscheidungOut of scope
Bedeutung für ImporteureNur Referenzhinweis
KN-Jahr2026
Referenzantwort

HS-/KN-Code 84569010 ist für die EUDR-Vorbereitung außerhalb des Geltungsbereichs.

Focused ion beam milling machines for producing or repairing masks and reticles for patterns on semiconductor devices Die indexierte Scope-Engine liefert für diesen Code das Ergebnis Out of scope. No Annex I scope match was found for this indexed CN code.

Geltungsbereichsgrundlage

Warum diese Referenzseite diese Antwort gibt.

Code-Beschreibung
Focused ion beam milling machines for producing or repairing masks and reticles for patterns on semiconductor devices
Anhang-I-Grundlage
Kein direkter Anhang-I-Eintrag
Quellengrundlage
Regulation (EU) 2023/1115 Annex I and CN 2026 index
KN-Hierarchie

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84kernreaktoren, kessel, maschinen, apparate und mechanische geräte; teile davonout8456machine tools for working any material by removal of material, by laser or other light or photon beam, ultrasonic, electro-discharge, electro-chemical, electron beam, ionic-beam or plasma arc processes; water-jet cutting machines (excl. cleaning apparatus operated by ultrasonic processes, soldering and welding machines, incl. those which can be used for cutting, and material testing machines)out845690machine tools for working any material by removal of material, operated by electro-chemical, electron beam or ionic-beam processes (excl. soldering and welding machines, material testing machines and machines for the manufacture of semiconductor devices or of electronic integrated circuits)(2007-2500);machine-tools for working any material by removal of material, operated by electro-chemical, electron beam, ionic-beam or plasma arc process (excl. soldering and welding machines, incl. those which can be used for cutting, and material testing machines)(1988-1995)out84569000machine tools for working any material by removal of material, operated by electro-chemical, electron beam or ionic-beam processes (excl. soldering and welding machines, material testing machines and machines for the manufacture of semiconductor devices or of electronic integrated circuits)(2017-2500);machine tools for working any material by removal of material, operated by electro-chemical processes or electron beam, ion beam or plasma arc processes (excl. for soldering and welding machines, materials testing machines and machines for the manufacture of semiconductor devices or of electronic integrated circuits)(2007-2011);machine-tools for working any material by removal of material, operated by electro-chemical, electron beam, ionic-beam or plasma arc processes (excl. soldering and welding machines, incl. those which can be used for cutting, and material testing machines)(1988-1994)out84569020water-jet cutting machinesout84569030machine tools for dry etching, stripping or cleaning semiconductor wafersout84569080machine tools for working any material by removal of material, operated by electro-chemical processes or electron beam, ion beam or plasma arc processes (excl. for soldering and welding machines, materials testing machines and machines for the manufacture of semiconductor devices or of electronic integrated circuits)out84569090machine tools for working any material by removal of any material by electro-chemical processes or electron beam, ion beam or plasma arc processes (excl. for soldering and welding machines, materials testing machines, focused ion beam milling machines for producing or repairing masks and reticles for patterns on semiconductor devices, and machine tools for dry etching, stripping or cleaning semiconductor wafers)out
Nachweismuster

Was das für die Vorbereitung bedeutet.

Diese Zeile ist im aktuellen Geltungsbereichs-Ergebnis kein direkter Auslöser für die Nachweiserhebung.

Quellen-Metadaten
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84569010 EUDR-HS-/KN-Geltungsbereichsreferenz | EUDR Tools