HS-/KN-Code 84569910 ist für die EUDR-Vorbereitung außerhalb des Geltungsbereichs.
Focused ion beam milling machines for producing or repairing masks and reticles for patterns on semiconductor devices Die indexierte Scope-Engine liefert für diesen Code das Ergebnis Out of scope. No Annex I scope match was found for this indexed CN code.
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- Code-Beschreibung
- Focused ion beam milling machines for producing or repairing masks and reticles for patterns on semiconductor devices
- Anhang-I-Grundlage
- Kein direkter Anhang-I-Eintrag
- Quellengrundlage
- Regulation (EU) 2023/1115 Annex I and CN 2026 index
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84kernreaktoren, kessel, maschinen, apparate und mechanische geräte; teile davonout8456machine tools for working any material by removal of material, by laser or other light or photon beam, ultrasonic, electro-discharge, electro-chemical, electron beam, ionic-beam or plasma arc processes; water-jet cutting machines (excl. cleaning apparatus operated by ultrasonic processes, soldering and welding machines, incl. those which can be used for cutting, and material testing machines)out845699machine tools for working any material by removal of material, operated by electro-chemical processes or electron beam, ion beam or plasma arc processes (excl. for soldering and welding machines, materials testing machines and apparatus for-dry etching semiconductor materials)out84569930machine tools for stripping or cleaning semiconductor wafers by electro-chemical processes or electron beam, ion beam or plasma arc processesout84569950machine tools for dry-etching patterns on lcd substrates by electro-chemical processes or electron beam, ion beam or plasma arc processesout84569980machine tools for working any material by removal of material, operated by electro-chemical processes or electron beam, ion beam or plasma arc processes (excl. for soldering and welding machines, materials testing machines, focused ion beam milling machines for producing or repairing masks and reticles for patterns on semiconductor devices, machine tools for dry-etching patterns on semiconductor materials and on lcd substrates, and apparatus for stripping or cleaning semiconductor wafers)out84569990machine-tools for working any material by removal of any material by electro-chemical processes or electron beam, ion beam or plasma arc processes (excl. for soldering and welding machines, materials testing machines, focused ion beam milling machines for producing or repairing masks and reticles for patterns on semiconductor devices, machine-tools for dry- etching patterns on semi-conductor materials and apparatus for stripping or cleaning semiconductor wafers)out
Was das für die Vorbereitung bedeutet.
Diese Zeile ist im aktuellen Geltungsbereichs-Ergebnis kein direkter Auslöser für die Nachweiserhebung.
Regulation (EU) 2023/1115 Annex I — relevant productsabgerufen am 2026-08-06Commission Delegated Regulation (EU) 2026/2102 amending Annex I to Regulation (EU) 2023/1115abgerufen am 2026-09-24Eurostat Comext Combined Nomenclature codelist (CXT_NC v11.0)abgerufen am 2026-08-06Eurostat Comext partner country codelist (CXT_FREE_ISO)abgerufen am 2026-08-06Eurostat Comext DS-045409 — EU trade since 1988 by HS2-4-6 and CN8abgerufen am 2026-08-06Commission Implementing Regulation (EU) 2025/1093 — country benchmarkingabgerufen am 2026-08-06Regulation (EU) 2025/2650 amending Regulation (EU) 2023/1115 as regards certain obligations of operators and tradersabgerufen am 2025-12-26Commission Implementing Regulation (EU) 2026/1565 amending Implementing Regulation (EU) 2024/3084 (EUDR information system)abgerufen am 2026-08-08