HS/CN-koodi 38180011 on soveltamisalan ulkopuolella EUDR-valmistelun kannalta.
Doped silicon wafers of a thickness <=200μm, rectangular, whether or not with cut or rounded corners "photovoltaic wafers" Indeksoitu soveltamisalamoottori palauttaa arvon Out of scope tälle koodille. No Annex I scope match was found for this indexed CN code.
Miksi tämä hakemistosivu antaa tämän vastauksen.
- Koodin kuvaus
- Doped silicon wafers of a thickness <=200μm, rectangular, whether or not with cut or rounded corners "photovoltaic wafers"
- Liite I -peruste
- Ei suoraa liite I -merkintää
- Lähdeperuste
- Regulation (EU) 2023/1115 Annex I and CN 2026 index
Yläkoodi, alakoodit ja lähirivit.
Kirjastonäkymä on tarkoitettu viitenavigointiin. Käytä tarkistinta, kun haluat suorittaa toisen koodin toimintona.
38ryhmä - erinäiset kemialliset tuotteetnarrower3818chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion)out381800chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion)out38180010silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion)out38180019silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and "photovoltaic" rectangular wafers of a thickness <=200μm)out38180090chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon)out
Mitä tämä tarkoittaa valmistelun kannalta.
Tämä rivi ei ole suora näytönkeruun laukaisin nykyisessä soveltamisalatuloksessa.
Regulation (EU) 2023/1115 Annex I — relevant productshaettu 2026-08-06Commission Delegated Regulation (EU) 2026/2102 amending Annex I to Regulation (EU) 2023/1115haettu 2026-09-24Eurostat Comext Combined Nomenclature codelist (CXT_NC v11.0)haettu 2026-08-06Eurostat Comext partner country codelist (CXT_FREE_ISO)haettu 2026-08-06Eurostat Comext DS-045409 — EU trade since 1988 by HS2-4-6 and CN8haettu 2026-08-06Commission Implementing Regulation (EU) 2025/1093 — country benchmarkinghaettu 2026-08-06Regulation (EU) 2025/2650 amending Regulation (EU) 2023/1115 as regards certain obligations of operators and tradershaettu 2025-12-26Commission Implementing Regulation (EU) 2026/1565 amending Implementing Regulation (EU) 2024/3084 (EUDR information system)haettu 2026-08-08