HS/CN-koodi 84561090 on soveltamisalan ulkopuolella EUDR-valmistelun kannalta.
Machine tools for working any material by removal of material, operated by laser or other light or photon beam processes (excl. those of a kind used in the manufacture of semiconductor wafers or devices, soldering and welding machines, incl. those which can be used for cutting, and material testing machines) Indeksoitu soveltamisalamoottori palauttaa arvon Out of scope tälle koodille. No Annex I scope match was found for this indexed CN code.
Miksi tämä hakemistosivu antaa tämän vastauksen.
- Koodin kuvaus
- Machine tools for working any material by removal of material, operated by laser or other light or photon beam processes (excl. those of a kind used in the manufacture of semiconductor wafers or devices, soldering and welding machines, incl. those which can be used for cutting, and material testing machines)
- Liite I -peruste
- Ei suoraa liite I -merkintää
- Lähdeperuste
- Regulation (EU) 2023/1115 Annex I and CN 2026 index
Yläkoodi, alakoodit ja lähirivit.
Kirjastonäkymä on tarkoitettu viitenavigointiin. Käytä tarkistinta, kun haluat suorittaa toisen koodin toimintona.
84ryhmä - ydinreaktorit, höyrykattilat, koneet ja mekaaniset laitteet; niiden osatout8456machine tools for working any material by removal of material, by laser or other light or photon beam, ultrasonic, electro-discharge, electro-chemical, electron beam, ionic-beam or plasma arc processes; water-jet cutting machines (excl. cleaning apparatus operated by ultrasonic processes, soldering and welding machines, incl. those which can be used for cutting, and material testing machines)out845610machine tools for working any material by removal of material, operated by laser or other light or photon beam processes (excl. soldering and welding machines, incl. those which can be used for cutting, material testing machines and machines for the manufacture of semiconductor devices or of electronic integrated circuits)out84561000machine tools for working any material by removal of material, operated by laser or other light or photon beam processes (excl. soldering and welding machines, incl. those which can be used for cutting, material testing machines and machines for the manufacture of semiconductor devices or of electronic integrated circuits)(2007-2016);machine-tools for working any material by removal of material, operated by laser or other light or photon beam processes (excl. soldering and welding machines, incl. those which can be used for cutting, and material testing machines)(1988-1997)out84561010machine tools for working any material by removal of material, operated by laser or other light or photon beam processes, of a kind used in the manufacture of semiconductor wafers or devicesout
Mitä tämä tarkoittaa valmistelun kannalta.
Tämä rivi ei ole suora näytönkeruun laukaisin nykyisessä soveltamisalatuloksessa.
Regulation (EU) 2023/1115 Annex I — relevant productshaettu 2026-08-06Commission Delegated Regulation (EU) 2026/2102 amending Annex I to Regulation (EU) 2023/1115haettu 2026-09-24Eurostat Comext Combined Nomenclature codelist (CXT_NC v11.0)haettu 2026-08-06Eurostat Comext partner country codelist (CXT_FREE_ISO)haettu 2026-08-06Eurostat Comext DS-045409 — EU trade since 1988 by HS2-4-6 and CN8haettu 2026-08-06Commission Implementing Regulation (EU) 2025/1093 — country benchmarkinghaettu 2026-08-06Regulation (EU) 2025/2650 amending Regulation (EU) 2023/1115 as regards certain obligations of operators and tradershaettu 2025-12-26Commission Implementing Regulation (EU) 2026/1565 amending Implementing Regulation (EU) 2024/3084 (EUDR information system)haettu 2026-08-08