HS/CN-koodi 845691 on soveltamisalan ulkopuolella EUDR-valmistelun kannalta.
Apparatus for dry-etching patterns on semiconductor materials Indeksoitu soveltamisalamoottori palauttaa arvon Out of scope tälle koodille. No Annex I scope match was found for this indexed CN code.
Miksi tämä hakemistosivu antaa tämän vastauksen.
- Koodin kuvaus
- Apparatus for dry-etching patterns on semiconductor materials
- Liite I -peruste
- Ei suoraa liite I -merkintää
- Lähdeperuste
- Regulation (EU) 2023/1115 Annex I and CN 2026 index
Yläkoodi, alakoodit ja lähirivit.
Kirjastonäkymä on tarkoitettu viitenavigointiin. Käytä tarkistinta, kun haluat suorittaa toisen koodin toimintona.
84ryhmä - ydinreaktorit, höyrykattilat, koneet ja mekaaniset laitteet; niiden osatout8456machine tools for working any material by removal of material, by laser or other light or photon beam, ultrasonic, electro-discharge, electro-chemical, electron beam, ionic-beam or plasma arc processes; water-jet cutting machines (excl. cleaning apparatus operated by ultrasonic processes, soldering and welding machines, incl. those which can be used for cutting, and material testing machines)out84569100apparatus for dry-etching patterns on semiconductor materialsout845610machine tools for working any material by removal of material, operated by laser or other light or photon beam processes (excl. soldering and welding machines, incl. those which can be used for cutting, material testing machines and machines for the manufacture of semiconductor devices or of electronic integrated circuits)out845611machine tools for working any material by removal of material, operated by laser (excl. soldering and welding machines, also those which can be used for cutting, material testing machines and machines for the manufacture of semiconductor devices or of electronic integrated circuits)out845612machine tools for working any material by removal of material, operated by light or photon beam processes other than laser (excl. soldering and welding machines, also those which can be used for cutting, material testing machines and machines for the manufacture of semiconductor devices or of electronic integrated circuits)out845620machine tools for working any material by removal of material, operated by ultrasonic processes (excl. cleaning apparatus operated by ultrasonic processes and material testing machines)out845630machine tools for working any material by removal of material, operated by electro-discharge processesout845640machine tools for working any material by removal of material, operated by plasma arc processesout
Mitä tämä tarkoittaa valmistelun kannalta.
Tämä rivi ei ole suora näytönkeruun laukaisin nykyisessä soveltamisalatuloksessa.
Regulation (EU) 2023/1115 Annex I — relevant productshaettu 2026-08-06Commission Delegated Regulation (EU) 2026/2102 amending Annex I to Regulation (EU) 2023/1115haettu 2026-09-24Eurostat Comext Combined Nomenclature codelist (CXT_NC v11.0)haettu 2026-08-06Eurostat Comext partner country codelist (CXT_FREE_ISO)haettu 2026-08-06Eurostat Comext DS-045409 — EU trade since 1988 by HS2-4-6 and CN8haettu 2026-08-06Commission Implementing Regulation (EU) 2025/1093 — country benchmarkinghaettu 2026-08-06Regulation (EU) 2025/2650 amending Regulation (EU) 2023/1115 as regards certain obligations of operators and tradershaettu 2025-12-26Commission Implementing Regulation (EU) 2026/1565 amending Implementing Regulation (EU) 2024/3084 (EUDR information system)haettu 2026-08-08