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HS/CN-soveltamisalakirjasto
Koodihakemistoryhmä - ydinreaktorit, höyrykattilat, koneet ja mekaaniset laitteet; niiden osat

Machine tools for working any material by removal of material, operated by electro-chemical processes or electron beam, ion beam or plasma arc processes (excl. for soldering and welding machines, materials testing machines and apparatus for-dry etching semiconductor materials)

Lähteellä päivätty hakemisto HS/CN-koodille 845699, sen EUDR-soveltamisalan perusteelle, CN-hierarkialle, näyttövaikutuksille ja liittyville indeksoiduille riveille.

ViitetyyppiHS/CN-soveltamisalatietue
SoveltamisalapäätösOut of scope
Vaikutus maahantuojalleVain viitemuistiinpano
CN-vuosi2026
Viitevastaus

HS/CN-koodi 845699 on soveltamisalan ulkopuolella EUDR-valmistelun kannalta.

Machine tools for working any material by removal of material, operated by electro-chemical processes or electron beam, ion beam or plasma arc processes (excl. for soldering and welding machines, materials testing machines and apparatus for-dry etching semiconductor materials) Indeksoitu soveltamisalamoottori palauttaa arvon Out of scope tälle koodille. No Annex I scope match was found for this indexed CN code.

Soveltamisalan peruste

Miksi tämä hakemistosivu antaa tämän vastauksen.

Koodin kuvaus
Machine tools for working any material by removal of material, operated by electro-chemical processes or electron beam, ion beam or plasma arc processes (excl. for soldering and welding machines, materials testing machines and apparatus for-dry etching semiconductor materials)
Liite I -peruste
Ei suoraa liite I -merkintää
Lähdeperuste
Regulation (EU) 2023/1115 Annex I and CN 2026 index
CN-hierarkia

Yläkoodi, alakoodit ja lähirivit.

Kirjastonäkymä on tarkoitettu viitenavigointiin. Käytä tarkistinta, kun haluat suorittaa toisen koodin toimintona.

84ryhmä - ydinreaktorit, höyrykattilat, koneet ja mekaaniset laitteet; niiden osatout8456machine tools for working any material by removal of material, by laser or other light or photon beam, ultrasonic, electro-discharge, electro-chemical, electron beam, ionic-beam or plasma arc processes; water-jet cutting machines (excl. cleaning apparatus operated by ultrasonic processes, soldering and welding machines, incl. those which can be used for cutting, and material testing machines)out84569910focused ion beam milling machines for producing or repairing masks and reticles for patterns on semiconductor devicesout84569930machine tools for stripping or cleaning semiconductor wafers by electro-chemical processes or electron beam, ion beam or plasma arc processesout84569950machine tools for dry-etching patterns on lcd substrates by electro-chemical processes or electron beam, ion beam or plasma arc processesout84569980machine tools for working any material by removal of material, operated by electro-chemical processes or electron beam, ion beam or plasma arc processes (excl. for soldering and welding machines, materials testing machines, focused ion beam milling machines for producing or repairing masks and reticles for patterns on semiconductor devices, machine tools for dry-etching patterns on semiconductor materials and on lcd substrates, and apparatus for stripping or cleaning semiconductor wafers)out84569990machine-tools for working any material by removal of any material by electro-chemical processes or electron beam, ion beam or plasma arc processes (excl. for soldering and welding machines, materials testing machines, focused ion beam milling machines for producing or repairing masks and reticles for patterns on semiconductor devices, machine-tools for dry- etching patterns on semi-conductor materials and apparatus for stripping or cleaning semiconductor wafers)out845610machine tools for working any material by removal of material, operated by laser or other light or photon beam processes (excl. soldering and welding machines, incl. those which can be used for cutting, material testing machines and machines for the manufacture of semiconductor devices or of electronic integrated circuits)out845611machine tools for working any material by removal of material, operated by laser (excl. soldering and welding machines, also those which can be used for cutting, material testing machines and machines for the manufacture of semiconductor devices or of electronic integrated circuits)out845612machine tools for working any material by removal of material, operated by light or photon beam processes other than laser (excl. soldering and welding machines, also those which can be used for cutting, material testing machines and machines for the manufacture of semiconductor devices or of electronic integrated circuits)out845620machine tools for working any material by removal of material, operated by ultrasonic processes (excl. cleaning apparatus operated by ultrasonic processes and material testing machines)out845630machine tools for working any material by removal of material, operated by electro-discharge processesout845640machine tools for working any material by removal of material, operated by plasma arc processesout
Näyttömalli

Mitä tämä tarkoittaa valmistelun kannalta.

Tämä rivi ei ole suora näytönkeruun laukaisin nykyisessä soveltamisalatuloksessa.

Lähdemetatiedot
Tarvitsetko nopean toimintonäkymän?Suorita sama koodi HS-soveltamisalan tarkistimessa.
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845699 EUDR HS/CN-soveltamisalan hakemisto | EUDR Tools