Para a preparação EUDR, o código SH/NC 38180011 está classificado como fora do âmbito.
Doped silicon wafers of a thickness <=200μm, rectangular, whether or not with cut or rounded corners "photovoltaic wafers" O motor de âmbito indexado devolve Out of scope para este código. No Annex I scope match was found for this indexed CN code.
Porque é que esta página de referência dá essa resposta.
- Descrição do código
- Doped silicon wafers of a thickness <=200μm, rectangular, whether or not with cut or rounded corners "photovoltaic wafers"
- Base no anexo I
- Sem entrada direta no anexo I
- Base da fonte
- Regulation (EU) 2023/1115 Annex I and CN 2026 index
Linhas ascendentes, descendentes e próximas.
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38produtos diversos das indústrias químicasnarrower3818chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion)out381800chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion)out38180010silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion)out38180019silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and "photovoltaic" rectangular wafers of a thickness <=200μm)out38180090chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon)out
O que isto significa para a preparação.
Esta linha não desencadeia diretamente a recolha de provas no resultado de âmbito atual.
Regulation (EU) 2023/1115 Annex I — relevant productsobtido em 2026-08-06Commission Delegated Regulation (EU) 2026/2102 amending Annex I to Regulation (EU) 2023/1115obtido em 2026-09-24Eurostat Comext Combined Nomenclature codelist (CXT_NC v11.0)obtido em 2026-08-06Eurostat Comext partner country codelist (CXT_FREE_ISO)obtido em 2026-08-06Eurostat Comext DS-045409 — EU trade since 1988 by HS2-4-6 and CN8obtido em 2026-08-06Commission Implementing Regulation (EU) 2025/1093 — country benchmarkingobtido em 2026-08-06Regulation (EU) 2025/2650 amending Regulation (EU) 2023/1115 as regards certain obligations of operators and tradersobtido em 2025-12-26Commission Implementing Regulation (EU) 2026/1565 amending Implementing Regulation (EU) 2024/3084 (EUDR information system)obtido em 2026-08-08