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HS/CN taikymo srities žinynas
Kodo informacijaskirsnis - branduoliniai reaktoriai, katilai, mašinos ir mechaniniai įrenginiai; jų dalys

Machine tools for working any material by removal of material, operated by laser or other light or photon beam processes (excl. soldering and welding machines, incl. those which can be used for cutting, material testing machines and machines for the manufacture of semiconductor devices or of electronic integrated circuits)

Šaltinio data pagrįsta informacija apie HS/CN kodą 845610, jo EUDR taikymo srities pagrindą, CN hierarchiją, poveikį įrodymams ir susijusias indeksuotas eilutes.

Informacijos tipasHS/CN taikymo srities įrašas
Taikymo srities sprendimasOut of scope
Poveikis importuotojuiTik informacinė pastaba
CN metai2026
Informacinis atsakymas

HS/CN kodas 845610 EUDR parengimui yra nepatenka į taikymo sritį.

Machine tools for working any material by removal of material, operated by laser or other light or photon beam processes (excl. soldering and welding machines, incl. those which can be used for cutting, material testing machines and machines for the manufacture of semiconductor devices or of electronic integrated circuits) Indeksuotas taikymo srities variklis šiam kodui grąžina Out of scope. No Annex I scope match was found for this indexed CN code.

Taikymo srities pagrindas

Kodėl šis informacinis puslapis pateikia tokį atsakymą.

Kodo aprašymas
Machine tools for working any material by removal of material, operated by laser or other light or photon beam processes (excl. soldering and welding machines, incl. those which can be used for cutting, material testing machines and machines for the manufacture of semiconductor devices or of electronic integrated circuits)
I priedo pagrindas
Nėra tiesioginio I priedo įrašo
Šaltinio pagrindas
Regulation (EU) 2023/1115 Annex I and CN 2026 index
CN hierarchija

Aukštesnio, žemesnio lygio ir gretimos eilutės.

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84skirsnis - branduoliniai reaktoriai, katilai, mašinos ir mechaniniai įrenginiai; jų dalysout8456machine tools for working any material by removal of material, by laser or other light or photon beam, ultrasonic, electro-discharge, electro-chemical, electron beam, ionic-beam or plasma arc processes; water-jet cutting machines (excl. cleaning apparatus operated by ultrasonic processes, soldering and welding machines, incl. those which can be used for cutting, and material testing machines)out84561000machine tools for working any material by removal of material, operated by laser or other light or photon beam processes (excl. soldering and welding machines, incl. those which can be used for cutting, material testing machines and machines for the manufacture of semiconductor devices or of electronic integrated circuits)(2007-2016);machine-tools for working any material by removal of material, operated by laser or other light or photon beam processes (excl. soldering and welding machines, incl. those which can be used for cutting, and material testing machines)(1988-1997)out84561010machine tools for working any material by removal of material, operated by laser or other light or photon beam processes, of a kind used in the manufacture of semiconductor wafers or devicesout84561090machine tools for working any material by removal of material, operated by laser or other light or photon beam processes (excl. those of a kind used in the manufacture of semiconductor wafers or devices, soldering and welding machines, incl. those which can be used for cutting, and material testing machines)out845611machine tools for working any material by removal of material, operated by laser (excl. soldering and welding machines, also those which can be used for cutting, material testing machines and machines for the manufacture of semiconductor devices or of electronic integrated circuits)out845612machine tools for working any material by removal of material, operated by light or photon beam processes other than laser (excl. soldering and welding machines, also those which can be used for cutting, material testing machines and machines for the manufacture of semiconductor devices or of electronic integrated circuits)out845620machine tools for working any material by removal of material, operated by ultrasonic processes (excl. cleaning apparatus operated by ultrasonic processes and material testing machines)out845630machine tools for working any material by removal of material, operated by electro-discharge processesout845640machine tools for working any material by removal of material, operated by plasma arc processesout845650water-jet cutting machinesout
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845610 EUDR HS/CN taikymo srities žinynas | EUDR Tools