HS/KN kods 38180011 EUDR sagatavošanas nolūkā: neietilpst darbības jomā.
Doped silicon wafers of a thickness <=200μm, rectangular, whether or not with cut or rounded corners "photovoltaic wafers" Indeksētais darbības jomas dzinējs šim kodam atgriež Out of scope. No Annex I scope match was found for this indexed CN code.
Kāpēc šī uzziņas lapa sniedz tādu atbildi.
- Koda apraksts
- Doped silicon wafers of a thickness <=200μm, rectangular, whether or not with cut or rounded corners "photovoltaic wafers"
- I pielikuma pamats
- Nav tieša I pielikuma ieraksta
- Avota pamats
- Regulation (EU) 2023/1115 Annex I and CN 2026 index
Augstāka līmeņa, pakārtotās un tuvās rindas.
Bibliotēkas skats paredzēts uzziņu navigācijai. Izmantojiet pārbaudītāju, ja vēlaties pārbaudīt citu kodu kā darbību.
38miscellaneous chemical productsnarrower3818chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion)out381800chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion)out38180010silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion)out38180019silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and "photovoltaic" rectangular wafers of a thickness <=200μm)out38180090chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon)out
Ko tas nozīmē sagatavošanai.
Pašreizējā darbības jomas rezultātā šī rinda tieši nerosina pierādījumu vākšanu.
Regulation (EU) 2023/1115 Annex I — relevant productsiegūts 2026-08-06Commission Delegated Regulation (EU) 2026/2102 amending Annex I to Regulation (EU) 2023/1115iegūts 2026-09-24Eurostat Comext Combined Nomenclature codelist (CXT_NC v11.0)iegūts 2026-08-06Eurostat Comext partner country codelist (CXT_FREE_ISO)iegūts 2026-08-06Eurostat Comext DS-045409 — EU trade since 1988 by HS2-4-6 and CN8iegūts 2026-08-06Commission Implementing Regulation (EU) 2025/1093 — country benchmarkingiegūts 2026-08-06Regulation (EU) 2025/2650 amending Regulation (EU) 2023/1115 as regards certain obligations of operators and tradersiegūts 2025-12-26Commission Implementing Regulation (EU) 2026/1565 amending Implementing Regulation (EU) 2024/3084 (EUDR information system)iegūts 2026-08-08