HS/KN kods 84561090 EUDR sagatavošanas nolūkā: neietilpst darbības jomā.
Machine tools for working any material by removal of material, operated by laser or other light or photon beam processes (excl. those of a kind used in the manufacture of semiconductor wafers or devices, soldering and welding machines, incl. those which can be used for cutting, and material testing machines) Indeksētais darbības jomas dzinējs šim kodam atgriež Out of scope. No Annex I scope match was found for this indexed CN code.
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- Koda apraksts
- Machine tools for working any material by removal of material, operated by laser or other light or photon beam processes (excl. those of a kind used in the manufacture of semiconductor wafers or devices, soldering and welding machines, incl. those which can be used for cutting, and material testing machines)
- I pielikuma pamats
- Nav tieša I pielikuma ieraksta
- Avota pamats
- Regulation (EU) 2023/1115 Annex I and CN 2026 index
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84nuclear reactors, boilers, machinery and mechanical appliances; parts thereofout8456machine tools for working any material by removal of material, by laser or other light or photon beam, ultrasonic, electro-discharge, electro-chemical, electron beam, ionic-beam or plasma arc processes; water-jet cutting machines (excl. cleaning apparatus operated by ultrasonic processes, soldering and welding machines, incl. those which can be used for cutting, and material testing machines)out845610machine tools for working any material by removal of material, operated by laser or other light or photon beam processes (excl. soldering and welding machines, incl. those which can be used for cutting, material testing machines and machines for the manufacture of semiconductor devices or of electronic integrated circuits)out84561000machine tools for working any material by removal of material, operated by laser or other light or photon beam processes (excl. soldering and welding machines, incl. those which can be used for cutting, material testing machines and machines for the manufacture of semiconductor devices or of electronic integrated circuits)(2007-2016);machine-tools for working any material by removal of material, operated by laser or other light or photon beam processes (excl. soldering and welding machines, incl. those which can be used for cutting, and material testing machines)(1988-1997)out84561010machine tools for working any material by removal of material, operated by laser or other light or photon beam processes, of a kind used in the manufacture of semiconductor wafers or devicesout
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Regulation (EU) 2023/1115 Annex I — relevant productsiegūts 2026-08-06Commission Delegated Regulation (EU) 2026/2102 amending Annex I to Regulation (EU) 2023/1115iegūts 2026-09-24Eurostat Comext Combined Nomenclature codelist (CXT_NC v11.0)iegūts 2026-08-06Eurostat Comext partner country codelist (CXT_FREE_ISO)iegūts 2026-08-06Eurostat Comext DS-045409 — EU trade since 1988 by HS2-4-6 and CN8iegūts 2026-08-06Commission Implementing Regulation (EU) 2025/1093 — country benchmarkingiegūts 2026-08-06Regulation (EU) 2025/2650 amending Regulation (EU) 2023/1115 as regards certain obligations of operators and tradersiegūts 2025-12-26Commission Implementing Regulation (EU) 2026/1565 amending Implementing Regulation (EU) 2024/3084 (EUDR information system)iegūts 2026-08-08