HS/KN kods 845690 EUDR sagatavošanas nolūkā: neietilpst darbības jomā.
Machine tools for working any material by removal of material, operated by electro-chemical, electron beam or ionic-beam processes (excl. soldering and welding machines, material testing machines and machines for the manufacture of semiconductor devices or of electronic integrated circuits)(2007-2500);Machine-tools for working any material by removal of material, operated by electro-chemical, electron beam, ionic-beam or plasma arc process (excl. soldering and welding machines, incl. those which can be used for cutting, and material testing machines)(1988-1995) Indeksētais darbības jomas dzinējs šim kodam atgriež Out of scope. No Annex I scope match was found for this indexed CN code.
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- Koda apraksts
- Machine tools for working any material by removal of material, operated by electro-chemical, electron beam or ionic-beam processes (excl. soldering and welding machines, material testing machines and machines for the manufacture of semiconductor devices or of electronic integrated circuits)(2007-2500);Machine-tools for working any material by removal of material, operated by electro-chemical, electron beam, ionic-beam or plasma arc process (excl. soldering and welding machines, incl. those which can be used for cutting, and material testing machines)(1988-1995)
- I pielikuma pamats
- Nav tieša I pielikuma ieraksta
- Avota pamats
- Regulation (EU) 2023/1115 Annex I and CN 2026 index
Augstāka līmeņa, pakārtotās un tuvās rindas.
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84nuclear reactors, boilers, machinery and mechanical appliances; parts thereofout8456machine tools for working any material by removal of material, by laser or other light or photon beam, ultrasonic, electro-discharge, electro-chemical, electron beam, ionic-beam or plasma arc processes; water-jet cutting machines (excl. cleaning apparatus operated by ultrasonic processes, soldering and welding machines, incl. those which can be used for cutting, and material testing machines)out84569000machine tools for working any material by removal of material, operated by electro-chemical, electron beam or ionic-beam processes (excl. soldering and welding machines, material testing machines and machines for the manufacture of semiconductor devices or of electronic integrated circuits)(2017-2500);machine tools for working any material by removal of material, operated by electro-chemical processes or electron beam, ion beam or plasma arc processes (excl. for soldering and welding machines, materials testing machines and machines for the manufacture of semiconductor devices or of electronic integrated circuits)(2007-2011);machine-tools for working any material by removal of material, operated by electro-chemical, electron beam, ionic-beam or plasma arc processes (excl. soldering and welding machines, incl. those which can be used for cutting, and material testing machines)(1988-1994)out84569010focused ion beam milling machines for producing or repairing masks and reticles for patterns on semiconductor devicesout84569020water-jet cutting machinesout84569030machine tools for dry etching, stripping or cleaning semiconductor wafersout84569080machine tools for working any material by removal of material, operated by electro-chemical processes or electron beam, ion beam or plasma arc processes (excl. for soldering and welding machines, materials testing machines and machines for the manufacture of semiconductor devices or of electronic integrated circuits)out84569090machine tools for working any material by removal of any material by electro-chemical processes or electron beam, ion beam or plasma arc processes (excl. for soldering and welding machines, materials testing machines, focused ion beam milling machines for producing or repairing masks and reticles for patterns on semiconductor devices, and machine tools for dry etching, stripping or cleaning semiconductor wafers)out845610machine tools for working any material by removal of material, operated by laser or other light or photon beam processes (excl. soldering and welding machines, incl. those which can be used for cutting, material testing machines and machines for the manufacture of semiconductor devices or of electronic integrated circuits)out845611machine tools for working any material by removal of material, operated by laser (excl. soldering and welding machines, also those which can be used for cutting, material testing machines and machines for the manufacture of semiconductor devices or of electronic integrated circuits)out845612machine tools for working any material by removal of material, operated by light or photon beam processes other than laser (excl. soldering and welding machines, also those which can be used for cutting, material testing machines and machines for the manufacture of semiconductor devices or of electronic integrated circuits)out845620machine tools for working any material by removal of material, operated by ultrasonic processes (excl. cleaning apparatus operated by ultrasonic processes and material testing machines)out845630machine tools for working any material by removal of material, operated by electro-discharge processesout845640machine tools for working any material by removal of material, operated by plasma arc processesout
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Regulation (EU) 2023/1115 Annex I — relevant productsiegūts 2026-08-06Commission Delegated Regulation (EU) 2026/2102 amending Annex I to Regulation (EU) 2023/1115iegūts 2026-09-24Eurostat Comext Combined Nomenclature codelist (CXT_NC v11.0)iegūts 2026-08-06Eurostat Comext partner country codelist (CXT_FREE_ISO)iegūts 2026-08-06Eurostat Comext DS-045409 — EU trade since 1988 by HS2-4-6 and CN8iegūts 2026-08-06Commission Implementing Regulation (EU) 2025/1093 — country benchmarkingiegūts 2026-08-06Regulation (EU) 2025/2650 amending Regulation (EU) 2023/1115 as regards certain obligations of operators and tradersiegūts 2025-12-26Commission Implementing Regulation (EU) 2026/1565 amending Implementing Regulation (EU) 2024/3084 (EUDR information system)iegūts 2026-08-08