Il-kodiċi HS/NM 84569930 huwa barra mill-kamp ta’ applikazzjoni għat-tħejjija għall-EUDR.
Machine tools for stripping or cleaning semiconductor wafers by electro-chemical processes or electron beam, ion beam or plasma arc processes Il-magna indiċizzata tal-kamp ta’ applikazzjoni tagħti Out of scope għal dan il-kodiċi. No Annex I scope match was found for this indexed CN code.
Għaliex din il-paġna ta’ referenza tagħti dik it-tweġiba.
- Deskrizzjoni tal-kodiċi
- Machine tools for stripping or cleaning semiconductor wafers by electro-chemical processes or electron beam, ion beam or plasma arc processes
- Bażi fl-Anness I
- L-ebda entrata diretta fl-Anness I
- Bażi tas-sors
- Regulation (EU) 2023/1115 Annex I and CN 2026 index
Ringieli ġenituri, subordinati u viċini.
Il-veduta tal-librerija hija għan-navigazzjoni ta’ referenza. Uża l-verifikatur meta trid tiċċekkja kodiċi ieħor bħala azzjoni.
84reatturi nukleari, boilers, makkinarju u apparati mekkaniċi; parts tagħhomout8456machine tools for working any material by removal of material, by laser or other light or photon beam, ultrasonic, electro-discharge, electro-chemical, electron beam, ionic-beam or plasma arc processes; water-jet cutting machines (excl. cleaning apparatus operated by ultrasonic processes, soldering and welding machines, incl. those which can be used for cutting, and material testing machines)out845699machine tools for working any material by removal of material, operated by electro-chemical processes or electron beam, ion beam or plasma arc processes (excl. for soldering and welding machines, materials testing machines and apparatus for-dry etching semiconductor materials)out84569910focused ion beam milling machines for producing or repairing masks and reticles for patterns on semiconductor devicesout84569950machine tools for dry-etching patterns on lcd substrates by electro-chemical processes or electron beam, ion beam or plasma arc processesout84569980machine tools for working any material by removal of material, operated by electro-chemical processes or electron beam, ion beam or plasma arc processes (excl. for soldering and welding machines, materials testing machines, focused ion beam milling machines for producing or repairing masks and reticles for patterns on semiconductor devices, machine tools for dry-etching patterns on semiconductor materials and on lcd substrates, and apparatus for stripping or cleaning semiconductor wafers)out84569990machine-tools for working any material by removal of any material by electro-chemical processes or electron beam, ion beam or plasma arc processes (excl. for soldering and welding machines, materials testing machines, focused ion beam milling machines for producing or repairing masks and reticles for patterns on semiconductor devices, machine-tools for dry- etching patterns on semi-conductor materials and apparatus for stripping or cleaning semiconductor wafers)out
Xi jfisser dan għat-tħejjija.
Din ir-ringiela mhijiex skattatur dirett għall-ġbir tal-evidenza fir-riżultat attwali tal-kamp ta’ applikazzjoni.
Regulation (EU) 2023/1115 Annex I — relevant productsmiksub fi 2026-08-06Commission Delegated Regulation (EU) 2026/2102 amending Annex I to Regulation (EU) 2023/1115miksub fi 2026-09-24Eurostat Comext Combined Nomenclature codelist (CXT_NC v11.0)miksub fi 2026-08-06Eurostat Comext partner country codelist (CXT_FREE_ISO)miksub fi 2026-08-06Eurostat Comext DS-045409 — EU trade since 1988 by HS2-4-6 and CN8miksub fi 2026-08-06Commission Implementing Regulation (EU) 2025/1093 — country benchmarkingmiksub fi 2026-08-06Regulation (EU) 2025/2650 amending Regulation (EU) 2023/1115 as regards certain obligations of operators and tradersmiksub fi 2025-12-26Commission Implementing Regulation (EU) 2026/1565 amending Implementing Regulation (EU) 2024/3084 (EUDR information system)miksub fi 2026-08-08