GS/GN-code 38180011 is buiten het toepassingsgebied voor EUDR-voorbereiding.
Doped silicon wafers of a thickness <=200μm, rectangular, whether or not with cut or rounded corners "photovoltaic wafers" De geïndexeerde scope-engine geeft Out of scope terug voor deze code. No Annex I scope match was found for this indexed CN code.
Waarom deze referentiepagina dat antwoord geeft.
- Codeomschrijving
- Doped silicon wafers of a thickness <=200μm, rectangular, whether or not with cut or rounded corners "photovoltaic wafers"
- Grondslag in bijlage I
- Geen directe vermelding in bijlage I
- Brongrondslag
- Regulation (EU) 2023/1115 Annex I and CN 2026 index
Bovenliggende, onderliggende en nabijgelegen rijen.
De bibliotheekweergave dient voor referentienavigatie. Gebruik de checker wanneer u een andere code als actie wilt uitvoeren.
38diverse producten van de chemische industrienarrower3818chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion)out381800chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion)out38180010silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion)out38180019silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and "photovoltaic" rectangular wafers of a thickness <=200μm)out38180090chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon)out
Wat dit betekent voor de voorbereiding.
Deze rij is in het huidige scoperesultaat geen directe trigger voor bewijsverzameling.
Regulation (EU) 2023/1115 Annex I — relevant productsopgehaald op 2026-08-06Commission Delegated Regulation (EU) 2026/2102 amending Annex I to Regulation (EU) 2023/1115opgehaald op 2026-09-24Eurostat Comext Combined Nomenclature codelist (CXT_NC v11.0)opgehaald op 2026-08-06Eurostat Comext partner country codelist (CXT_FREE_ISO)opgehaald op 2026-08-06Eurostat Comext DS-045409 — EU trade since 1988 by HS2-4-6 and CN8opgehaald op 2026-08-06Commission Implementing Regulation (EU) 2025/1093 — country benchmarkingopgehaald op 2026-08-06Regulation (EU) 2025/2650 amending Regulation (EU) 2023/1115 as regards certain obligations of operators and tradersopgehaald op 2025-12-26Commission Implementing Regulation (EU) 2026/1565 amending Implementing Regulation (EU) 2024/3084 (EUDR information system)opgehaald op 2026-08-08