Odpowiedź referencyjnaKod HS/CN 84569990 jest poza zakresem na potrzeby przygotowania EUDR.
Machine-tools for working any material by removal of any material by electro-chemical processes or electron beam, ion beam or plasma arc processes (excl. for soldering and welding machines, materials testing machines, focused ion beam milling machines for producing or repairing masks and reticles for patterns on semiconductor devices, machine-tools for dry- etching patterns on semi-conductor materials and apparatus for stripping or cleaning semiconductor wafers) Zaindeksowany silnik zakresu zwraca dla tego kodu wynik Out of scope. No Annex I scope match was found for this indexed CN code.
Podstawa zakresuDlaczego ta strona referencyjna daje taką odpowiedź.
- Opis kodu
- Machine-tools for working any material by removal of any material by electro-chemical processes or electron beam, ion beam or plasma arc processes (excl. for soldering and welding machines, materials testing machines, focused ion beam milling machines for producing or repairing masks and reticles for patterns on semiconductor devices, machine-tools for dry- etching patterns on semi-conductor materials and apparatus for stripping or cleaning semiconductor wafers)
- Podstawa w załączniku I
- Brak bezpośredniej pozycji w załączniku I
- Podstawa źródłowa
- Regulation (EU) 2023/1115 Annex I and CN 2026 index
Hierarchia CNWiersze nadrzędne, podrzędne i sąsiednie.
Widok biblioteki służy do nawigacji referencyjnej. Użyj weryfikatora, gdy chcesz uruchomić inny kod jako działanie.
84reaktory jądrowe, kotły, maszyny i urządzenia mechaniczne; ich częściout8456machine tools for working any material by removal of material, by laser or other light or photon beam, ultrasonic, electro-discharge, electro-chemical, electron beam, ionic-beam or plasma arc processes; water-jet cutting machines (excl. cleaning apparatus operated by ultrasonic processes, soldering and welding machines, incl. those which can be used for cutting, and material testing machines)out845699machine tools for working any material by removal of material, operated by electro-chemical processes or electron beam, ion beam or plasma arc processes (excl. for soldering and welding machines, materials testing machines and apparatus for-dry etching semiconductor materials)out84569910focused ion beam milling machines for producing or repairing masks and reticles for patterns on semiconductor devicesout84569930machine tools for stripping or cleaning semiconductor wafers by electro-chemical processes or electron beam, ion beam or plasma arc processesout84569950machine tools for dry-etching patterns on lcd substrates by electro-chemical processes or electron beam, ion beam or plasma arc processesout84569980machine tools for working any material by removal of material, operated by electro-chemical processes or electron beam, ion beam or plasma arc processes (excl. for soldering and welding machines, materials testing machines, focused ion beam milling machines for producing or repairing masks and reticles for patterns on semiconductor devices, machine tools for dry-etching patterns on semiconductor materials and on lcd substrates, and apparatus for stripping or cleaning semiconductor wafers)out Wzorzec dowodowyCo to oznacza dla przygotowania.
Ten wiersz nie uruchamia bezpośrednio zbierania dowodów w bieżącym wyniku zakresu.