Parts and accessories for machines and apparatus of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devices, electronic integrated circuits or flat panel displays, and for machines and apparatus specified in note 9 C to chapter 84, n.e.s. (excl. tool holders, self-opening dieheads, workholders, those of spinners for coating photographic emulsions, for physical deposition by sputtering, for dry-etching patterns, for chemical vapour deposition, on liquid crystal devices "LCD" substrates, of deflash machines for cleaning the metal leads of semiconductor packages prior to the electroplating and for machine-tools operated by ultrasonic processes)

Kod HS/CN 84869090 jest poza zakresem na potrzeby przygotowania EUDR.

Parts and accessories for machines and apparatus of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devices, electronic integrated circuits or flat panel displays, and for machines and apparatus specified in note 9 C to chapter 84, n.e.s. (excl. tool holders, self-opening dieheads, workholders, those of spinners for coating photographic emulsions, for physical deposition by sputtering, for dry-etching patterns, for chemical vapour deposition, on liquid crystal devices "LCD" substrates, of deflash machines for cleaning the metal leads of semiconductor packages prior to the electroplating and for machine-tools operated by ultrasonic processes) Zaindeksowany silnik zakresu zwraca dla tego kodu wynik Out of scope. No Annex I scope match was found for this indexed CN code.

Dlaczego ta strona referencyjna daje taką odpowiedź.

Opis kodu

Parts and accessories for machines and apparatus of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devices, electronic integrated circuits or flat panel displays, and for machines and apparatus specified in note 9 C to chapter 84, n.e.s. (excl. tool holders, self-opening dieheads, workholders, those of spinners for coating photographic emulsions, for physical deposition by sputtering, for dry-etching patterns, for chemical vapour deposition, on liquid crystal devices "LCD" substrates, of deflash machines for cleaning the metal leads of semiconductor packages prior to the electroplating and for machine-tools operated by ultrasonic processes)

Podstawa w załączniku I

Brak bezpośredniej pozycji w załączniku I

Podstawa źródłowa

Regulation (EU) 2023/1115 Annex I and CN 2026 index

Wiersze nadrzędne, podrzędne i sąsiednie.

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