Referenčná odpoveďKód HS/CN 381800 je pre prípravu EUDR mimo rozsahu pôsobnosti.
Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion) Indexovaný motor rozsahu pôsobnosti vracia pre tento kód Out of scope. No Annex I scope match was found for this indexed CN code.
Základ rozsahu pôsobnostiPrečo táto referenčná stránka dáva takúto odpoveď.
- Popis kódu
- Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion)
- Základ v Prílohe I
- Žiadna priama položka v Prílohe I
- Základ zdroja
- Regulation (EU) 2023/1115 Annex I and CN 2026 index
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38miscellaneous chemical productsnarrower3818chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion)out38180010silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion)out38180011doped silicon wafers of a thickness <=200μm, rectangular, whether or not with cut or rounded corners "photovoltaic wafers"out38180019silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and "photovoltaic" rectangular wafers of a thickness <=200μm)out38180090chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon)out Vzor dokladovČo to znamená pre prípravu.
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