El código SA/NC 38180011 se considera fuera del ámbito para la preparación EUDR.
Doped silicon wafers of a thickness <=200μm, rectangular, whether or not with cut or rounded corners "photovoltaic wafers" El motor de ámbito indexado devuelve Out of scope para este código. No Annex I scope match was found for this indexed CN code.
Por qué esta página de referencia da esa respuesta.
- Descripción del código
- Doped silicon wafers of a thickness <=200μm, rectangular, whether or not with cut or rounded corners "photovoltaic wafers"
- Base en el anexo I
- Sin entrada directa en el anexo I
- Base de la fuente
- Regulation (EU) 2023/1115 Annex I and CN 2026 index
Filas superiores, inferiores y próximas.
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38productos diversos de las industrias químicasnarrower3818chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion)out381800chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion)out38180010silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion)out38180019silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and "photovoltaic" rectangular wafers of a thickness <=200μm)out38180090chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon)out
Qué significa esto para la preparación.
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Regulation (EU) 2023/1115 Annex I — relevant productsconsultado el 2026-08-06Commission Delegated Regulation (EU) 2026/2102 amending Annex I to Regulation (EU) 2023/1115consultado el 2026-09-24Eurostat Comext Combined Nomenclature codelist (CXT_NC v11.0)consultado el 2026-08-06Eurostat Comext partner country codelist (CXT_FREE_ISO)consultado el 2026-08-06Eurostat Comext DS-045409 — EU trade since 1988 by HS2-4-6 and CN8consultado el 2026-08-06Commission Implementing Regulation (EU) 2025/1093 — country benchmarkingconsultado el 2026-08-06Regulation (EU) 2025/2650 amending Regulation (EU) 2023/1115 as regards certain obligations of operators and tradersconsultado el 2025-12-26Commission Implementing Regulation (EU) 2026/1565 amending Implementing Regulation (EU) 2024/3084 (EUDR information system)consultado el 2026-08-08