El código SA/NC 84569930 se considera fuera del ámbito para la preparación EUDR.
Machine tools for stripping or cleaning semiconductor wafers by electro-chemical processes or electron beam, ion beam or plasma arc processes El motor de ámbito indexado devuelve Out of scope para este código. No Annex I scope match was found for this indexed CN code.
Por qué esta página de referencia da esa respuesta.
- Descripción del código
- Machine tools for stripping or cleaning semiconductor wafers by electro-chemical processes or electron beam, ion beam or plasma arc processes
- Base en el anexo I
- Sin entrada directa en el anexo I
- Base de la fuente
- Regulation (EU) 2023/1115 Annex I and CN 2026 index
Filas superiores, inferiores y próximas.
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84reactores nucleares, calderas, máquinas, aparatos y artefactos mecánicos; partes de estas máquinas o aparatosout8456machine tools for working any material by removal of material, by laser or other light or photon beam, ultrasonic, electro-discharge, electro-chemical, electron beam, ionic-beam or plasma arc processes; water-jet cutting machines (excl. cleaning apparatus operated by ultrasonic processes, soldering and welding machines, incl. those which can be used for cutting, and material testing machines)out845699machine tools for working any material by removal of material, operated by electro-chemical processes or electron beam, ion beam or plasma arc processes (excl. for soldering and welding machines, materials testing machines and apparatus for-dry etching semiconductor materials)out84569910focused ion beam milling machines for producing or repairing masks and reticles for patterns on semiconductor devicesout84569950machine tools for dry-etching patterns on lcd substrates by electro-chemical processes or electron beam, ion beam or plasma arc processesout84569980machine tools for working any material by removal of material, operated by electro-chemical processes or electron beam, ion beam or plasma arc processes (excl. for soldering and welding machines, materials testing machines, focused ion beam milling machines for producing or repairing masks and reticles for patterns on semiconductor devices, machine tools for dry-etching patterns on semiconductor materials and on lcd substrates, and apparatus for stripping or cleaning semiconductor wafers)out84569990machine-tools for working any material by removal of any material by electro-chemical processes or electron beam, ion beam or plasma arc processes (excl. for soldering and welding machines, materials testing machines, focused ion beam milling machines for producing or repairing masks and reticles for patterns on semiconductor devices, machine-tools for dry- etching patterns on semi-conductor materials and apparatus for stripping or cleaning semiconductor wafers)out
Qué significa esto para la preparación.
Esta fila no activa directamente la recogida de pruebas en el resultado de ámbito actual.
Regulation (EU) 2023/1115 Annex I — relevant productsconsultado el 2026-08-06Commission Delegated Regulation (EU) 2026/2102 amending Annex I to Regulation (EU) 2023/1115consultado el 2026-09-24Eurostat Comext Combined Nomenclature codelist (CXT_NC v11.0)consultado el 2026-08-06Eurostat Comext partner country codelist (CXT_FREE_ISO)consultado el 2026-08-06Eurostat Comext DS-045409 — EU trade since 1988 by HS2-4-6 and CN8consultado el 2026-08-06Commission Implementing Regulation (EU) 2025/1093 — country benchmarkingconsultado el 2026-08-06Regulation (EU) 2025/2650 amending Regulation (EU) 2023/1115 as regards certain obligations of operators and tradersconsultado el 2025-12-26Commission Implementing Regulation (EU) 2026/1565 amending Implementing Regulation (EU) 2024/3084 (EUDR information system)consultado el 2026-08-08