Le code SH/NC 38180010 est hors champ d'application pour la préparation RDUE.
Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion) Le moteur de champ d'application indexé renvoie Out of scope pour ce code. No Annex I scope match was found for this indexed CN code.
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- Description du code
- Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion)
- Base annexe I
- Aucune entrée directe à l'annexe I
- Base de la source
- Regulation (EU) 2023/1115 Annex I and CN 2026 index
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38produits divers des industries chimiquesnarrower3818chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion)out381800chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion)out38180011doped silicon wafers of a thickness <=200μm, rectangular, whether or not with cut or rounded corners "photovoltaic wafers"out38180019silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and "photovoltaic" rectangular wafers of a thickness <=200μm)out38180090chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon)out
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Regulation (EU) 2023/1115 Annex I — relevant productsconsulté le 2026-08-06Commission Delegated Regulation (EU) 2026/2102 amending Annex I to Regulation (EU) 2023/1115consulté le 2026-09-24Eurostat Comext Combined Nomenclature codelist (CXT_NC v11.0)consulté le 2026-08-06Eurostat Comext partner country codelist (CXT_FREE_ISO)consulté le 2026-08-06Eurostat Comext DS-045409 — EU trade since 1988 by HS2-4-6 and CN8consulté le 2026-08-06Commission Implementing Regulation (EU) 2025/1093 — country benchmarkingconsulté le 2026-08-06Regulation (EU) 2025/2650 amending Regulation (EU) 2023/1115 as regards certain obligations of operators and tradersconsulté le 2025-12-26Commission Implementing Regulation (EU) 2026/1565 amending Implementing Regulation (EU) 2024/3084 (EUDR information system)consulté le 2026-08-08