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Biblioteka zakresu HS/CN
Referencja kodureaktory jądrowe, kotły, maszyny i urządzenia mechaniczne; ich części

Machine tools for working any material by removal of material, operated by laser or other light or photon beam processes (excl. soldering and welding machines, incl. those which can be used for cutting, material testing machines and machines for the manufacture of semiconductor devices or of electronic integrated circuits)

Datowana źródłowo referencja dla kodu HS/CN 845610: podstawa zakresu EUDR, hierarchia CN, konsekwencje dowodowe i powiązane zaindeksowane wiersze.

Typ referencjiRekord zakresu HS/CN
Decyzja o zakresieOut of scope
Konsekwencja dla importeraWyłącznie notatka referencyjna
Rok CN2026
Odpowiedź referencyjna

Kod HS/CN 845610 jest poza zakresem na potrzeby przygotowania EUDR.

Machine tools for working any material by removal of material, operated by laser or other light or photon beam processes (excl. soldering and welding machines, incl. those which can be used for cutting, material testing machines and machines for the manufacture of semiconductor devices or of electronic integrated circuits) Zaindeksowany silnik zakresu zwraca dla tego kodu wynik Out of scope. No Annex I scope match was found for this indexed CN code.

Podstawa zakresu

Dlaczego ta strona referencyjna daje taką odpowiedź.

Opis kodu
Machine tools for working any material by removal of material, operated by laser or other light or photon beam processes (excl. soldering and welding machines, incl. those which can be used for cutting, material testing machines and machines for the manufacture of semiconductor devices or of electronic integrated circuits)
Podstawa w załączniku I
Brak bezpośredniej pozycji w załączniku I
Podstawa źródłowa
Regulation (EU) 2023/1115 Annex I and CN 2026 index
Hierarchia CN

Wiersze nadrzędne, podrzędne i sąsiednie.

Widok biblioteki służy do nawigacji referencyjnej. Użyj weryfikatora, gdy chcesz uruchomić inny kod jako działanie.

84reaktory jądrowe, kotły, maszyny i urządzenia mechaniczne; ich częściout8456machine tools for working any material by removal of material, by laser or other light or photon beam, ultrasonic, electro-discharge, electro-chemical, electron beam, ionic-beam or plasma arc processes; water-jet cutting machines (excl. cleaning apparatus operated by ultrasonic processes, soldering and welding machines, incl. those which can be used for cutting, and material testing machines)out84561000machine tools for working any material by removal of material, operated by laser or other light or photon beam processes (excl. soldering and welding machines, incl. those which can be used for cutting, material testing machines and machines for the manufacture of semiconductor devices or of electronic integrated circuits)(2007-2016);machine-tools for working any material by removal of material, operated by laser or other light or photon beam processes (excl. soldering and welding machines, incl. those which can be used for cutting, and material testing machines)(1988-1997)out84561010machine tools for working any material by removal of material, operated by laser or other light or photon beam processes, of a kind used in the manufacture of semiconductor wafers or devicesout84561090machine tools for working any material by removal of material, operated by laser or other light or photon beam processes (excl. those of a kind used in the manufacture of semiconductor wafers or devices, soldering and welding machines, incl. those which can be used for cutting, and material testing machines)out845611machine tools for working any material by removal of material, operated by laser (excl. soldering and welding machines, also those which can be used for cutting, material testing machines and machines for the manufacture of semiconductor devices or of electronic integrated circuits)out845612machine tools for working any material by removal of material, operated by light or photon beam processes other than laser (excl. soldering and welding machines, also those which can be used for cutting, material testing machines and machines for the manufacture of semiconductor devices or of electronic integrated circuits)out845620machine tools for working any material by removal of material, operated by ultrasonic processes (excl. cleaning apparatus operated by ultrasonic processes and material testing machines)out845630machine tools for working any material by removal of material, operated by electro-discharge processesout845640machine tools for working any material by removal of material, operated by plasma arc processesout845650water-jet cutting machinesout
Wzorzec dowodowy

Co to oznacza dla przygotowania.

Ten wiersz nie uruchamia bezpośrednio zbierania dowodów w bieżącym wyniku zakresu.

Metadane źródeł
Potrzebujesz szybkiego widoku działania?Uruchom ten sam kod w weryfikatorze zakresu HS.
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845610 — referencja zakresu HS/CN w EUDR | EUDR Tools