Kod HS/CN 84561090 jest poza zakresem na potrzeby przygotowania EUDR.
Machine tools for working any material by removal of material, operated by laser or other light or photon beam processes (excl. those of a kind used in the manufacture of semiconductor wafers or devices, soldering and welding machines, incl. those which can be used for cutting, and material testing machines) Zaindeksowany silnik zakresu zwraca dla tego kodu wynik Out of scope. No Annex I scope match was found for this indexed CN code.
Dlaczego ta strona referencyjna daje taką odpowiedź.
- Opis kodu
- Machine tools for working any material by removal of material, operated by laser or other light or photon beam processes (excl. those of a kind used in the manufacture of semiconductor wafers or devices, soldering and welding machines, incl. those which can be used for cutting, and material testing machines)
- Podstawa w załączniku I
- Brak bezpośredniej pozycji w załączniku I
- Podstawa źródłowa
- Regulation (EU) 2023/1115 Annex I and CN 2026 index
Wiersze nadrzędne, podrzędne i sąsiednie.
Widok biblioteki służy do nawigacji referencyjnej. Użyj weryfikatora, gdy chcesz uruchomić inny kod jako działanie.
84reaktory jądrowe, kotły, maszyny i urządzenia mechaniczne; ich częściout8456machine tools for working any material by removal of material, by laser or other light or photon beam, ultrasonic, electro-discharge, electro-chemical, electron beam, ionic-beam or plasma arc processes; water-jet cutting machines (excl. cleaning apparatus operated by ultrasonic processes, soldering and welding machines, incl. those which can be used for cutting, and material testing machines)out845610machine tools for working any material by removal of material, operated by laser or other light or photon beam processes (excl. soldering and welding machines, incl. those which can be used for cutting, material testing machines and machines for the manufacture of semiconductor devices or of electronic integrated circuits)out84561000machine tools for working any material by removal of material, operated by laser or other light or photon beam processes (excl. soldering and welding machines, incl. those which can be used for cutting, material testing machines and machines for the manufacture of semiconductor devices or of electronic integrated circuits)(2007-2016);machine-tools for working any material by removal of material, operated by laser or other light or photon beam processes (excl. soldering and welding machines, incl. those which can be used for cutting, and material testing machines)(1988-1997)out84561010machine tools for working any material by removal of material, operated by laser or other light or photon beam processes, of a kind used in the manufacture of semiconductor wafers or devicesout
Co to oznacza dla przygotowania.
Ten wiersz nie uruchamia bezpośrednio zbierania dowodów w bieżącym wyniku zakresu.
Regulation (EU) 2023/1115 Annex I — relevant productspobrano 2026-08-06Commission Delegated Regulation (EU) 2026/2102 amending Annex I to Regulation (EU) 2023/1115pobrano 2026-09-24Eurostat Comext Combined Nomenclature codelist (CXT_NC v11.0)pobrano 2026-08-06Eurostat Comext partner country codelist (CXT_FREE_ISO)pobrano 2026-08-06Eurostat Comext DS-045409 — EU trade since 1988 by HS2-4-6 and CN8pobrano 2026-08-06Commission Implementing Regulation (EU) 2025/1093 — country benchmarkingpobrano 2026-08-06Regulation (EU) 2025/2650 amending Regulation (EU) 2023/1115 as regards certain obligations of operators and traderspobrano 2025-12-26Commission Implementing Regulation (EU) 2026/1565 amending Implementing Regulation (EU) 2024/3084 (EUDR information system)pobrano 2026-08-08