Parts and accessories for machine tools for working any material by removal of material operated by laser or other light or photon beam processes of a kind used in the manufacture of semiconductor wafers or devices, for apparatus for dry-etching patterns on semiconductor materials, for focused ion beam milling machines for producing or repairing masks and reticles for patterns on semiconductor devices and for machine tools for stripping or cleaning semiconductor wafers, n.e.s.

Nieobjęty rozporządzeniem. Dla tego zaindeksowanego kodu CN nie znaleziono dopasowania do zakresu załącznika I.