Koda HS/CN 845690 je za pripravo na EUDR izven področja uporabe.
Machine tools for working any material by removal of material, operated by electro-chemical, electron beam or ionic-beam processes (excl. soldering and welding machines, material testing machines and machines for the manufacture of semiconductor devices or of electronic integrated circuits)(2007-2500);Machine-tools for working any material by removal of material, operated by electro-chemical, electron beam, ionic-beam or plasma arc process (excl. soldering and welding machines, incl. those which can be used for cutting, and material testing machines)(1988-1995) Indeksirani mehanizem za področje uporabe za to kodo vrne Out of scope. No Annex I scope match was found for this indexed CN code.
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- Opis kode
- Machine tools for working any material by removal of material, operated by electro-chemical, electron beam or ionic-beam processes (excl. soldering and welding machines, material testing machines and machines for the manufacture of semiconductor devices or of electronic integrated circuits)(2007-2500);Machine-tools for working any material by removal of material, operated by electro-chemical, electron beam, ionic-beam or plasma arc process (excl. soldering and welding machines, incl. those which can be used for cutting, and material testing machines)(1988-1995)
- Podlaga v Prilogi I
- Ni neposrednega vnosa v Prilogi I
- Izvorna podlaga
- Regulation (EU) 2023/1115 Annex I and CN 2026 index
Nadrejene, podrejene in sosednje vrstice.
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84jedrski reaktorji, kotli, stroji in mehanske naprave; njihovi deliout8456machine tools for working any material by removal of material, by laser or other light or photon beam, ultrasonic, electro-discharge, electro-chemical, electron beam, ionic-beam or plasma arc processes; water-jet cutting machines (excl. cleaning apparatus operated by ultrasonic processes, soldering and welding machines, incl. those which can be used for cutting, and material testing machines)out84569000machine tools for working any material by removal of material, operated by electro-chemical, electron beam or ionic-beam processes (excl. soldering and welding machines, material testing machines and machines for the manufacture of semiconductor devices or of electronic integrated circuits)(2017-2500);machine tools for working any material by removal of material, operated by electro-chemical processes or electron beam, ion beam or plasma arc processes (excl. for soldering and welding machines, materials testing machines and machines for the manufacture of semiconductor devices or of electronic integrated circuits)(2007-2011);machine-tools for working any material by removal of material, operated by electro-chemical, electron beam, ionic-beam or plasma arc processes (excl. soldering and welding machines, incl. those which can be used for cutting, and material testing machines)(1988-1994)out84569010focused ion beam milling machines for producing or repairing masks and reticles for patterns on semiconductor devicesout84569020water-jet cutting machinesout84569030machine tools for dry etching, stripping or cleaning semiconductor wafersout84569080machine tools for working any material by removal of material, operated by electro-chemical processes or electron beam, ion beam or plasma arc processes (excl. for soldering and welding machines, materials testing machines and machines for the manufacture of semiconductor devices or of electronic integrated circuits)out84569090machine tools for working any material by removal of any material by electro-chemical processes or electron beam, ion beam or plasma arc processes (excl. for soldering and welding machines, materials testing machines, focused ion beam milling machines for producing or repairing masks and reticles for patterns on semiconductor devices, and machine tools for dry etching, stripping or cleaning semiconductor wafers)out845610machine tools for working any material by removal of material, operated by laser or other light or photon beam processes (excl. soldering and welding machines, incl. those which can be used for cutting, material testing machines and machines for the manufacture of semiconductor devices or of electronic integrated circuits)out845611machine tools for working any material by removal of material, operated by laser (excl. soldering and welding machines, also those which can be used for cutting, material testing machines and machines for the manufacture of semiconductor devices or of electronic integrated circuits)out845612machine tools for working any material by removal of material, operated by light or photon beam processes other than laser (excl. soldering and welding machines, also those which can be used for cutting, material testing machines and machines for the manufacture of semiconductor devices or of electronic integrated circuits)out845620machine tools for working any material by removal of material, operated by ultrasonic processes (excl. cleaning apparatus operated by ultrasonic processes and material testing machines)out845630machine tools for working any material by removal of material, operated by electro-discharge processesout845640machine tools for working any material by removal of material, operated by plasma arc processesout
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Ta vrstica v trenutnem rezultatu področja uporabe ni neposreden sprožilec zbiranja dokazov.
Regulation (EU) 2023/1115 Annex I — relevant productspridobljeno 2026-08-06Commission Delegated Regulation (EU) 2026/2102 amending Annex I to Regulation (EU) 2023/1115pridobljeno 2026-09-24Eurostat Comext Combined Nomenclature codelist (CXT_NC v11.0)pridobljeno 2026-08-06Eurostat Comext partner country codelist (CXT_FREE_ISO)pridobljeno 2026-08-06Eurostat Comext DS-045409 — EU trade since 1988 by HS2-4-6 and CN8pridobljeno 2026-08-06Commission Implementing Regulation (EU) 2025/1093 — country benchmarkingpridobljeno 2026-08-06Regulation (EU) 2025/2650 amending Regulation (EU) 2023/1115 as regards certain obligations of operators and traderspridobljeno 2025-12-26Commission Implementing Regulation (EU) 2026/1565 amending Implementing Regulation (EU) 2024/3084 (EUDR information system)pridobljeno 2026-08-08