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Knjižnica področja uporabe HS/CN
Referenca kodejedrski reaktorji, kotli, stroji in mehanske naprave; njihovi deli

Machine tools for working any material by removal of material, operated by electro-chemical processes or electron beam, ion beam or plasma arc processes (excl. for soldering and welding machines, materials testing machines and machines for the manufacture of semiconductor devices or of electronic integrated circuits)

Datirana referenca za kodo HS/CN 84569080, njeno podlago za področje uporabe EUDR, hierarhijo CN, posledice za dokaze in povezane indeksirane vrstice.

Vrsta referenceZapis področja uporabe HS/CN
Odločitev o področju uporabeOut of scope
Posledica za uvoznikaSamo referenčna opomba
Leto CN2026
Referenčni odgovor

Koda HS/CN 84569080 je za pripravo na EUDR izven področja uporabe.

Machine tools for working any material by removal of material, operated by electro-chemical processes or electron beam, ion beam or plasma arc processes (excl. for soldering and welding machines, materials testing machines and machines for the manufacture of semiconductor devices or of electronic integrated circuits) Indeksirani mehanizem za področje uporabe za to kodo vrne Out of scope. No Annex I scope match was found for this indexed CN code.

Podlaga področja uporabe

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Opis kode
Machine tools for working any material by removal of material, operated by electro-chemical processes or electron beam, ion beam or plasma arc processes (excl. for soldering and welding machines, materials testing machines and machines for the manufacture of semiconductor devices or of electronic integrated circuits)
Podlaga v Prilogi I
Ni neposrednega vnosa v Prilogi I
Izvorna podlaga
Regulation (EU) 2023/1115 Annex I and CN 2026 index
Hierarhija CN

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84jedrski reaktorji, kotli, stroji in mehanske naprave; njihovi deliout8456machine tools for working any material by removal of material, by laser or other light or photon beam, ultrasonic, electro-discharge, electro-chemical, electron beam, ionic-beam or plasma arc processes; water-jet cutting machines (excl. cleaning apparatus operated by ultrasonic processes, soldering and welding machines, incl. those which can be used for cutting, and material testing machines)out845690machine tools for working any material by removal of material, operated by electro-chemical, electron beam or ionic-beam processes (excl. soldering and welding machines, material testing machines and machines for the manufacture of semiconductor devices or of electronic integrated circuits)(2007-2500);machine-tools for working any material by removal of material, operated by electro-chemical, electron beam, ionic-beam or plasma arc process (excl. soldering and welding machines, incl. those which can be used for cutting, and material testing machines)(1988-1995)out84569000machine tools for working any material by removal of material, operated by electro-chemical, electron beam or ionic-beam processes (excl. soldering and welding machines, material testing machines and machines for the manufacture of semiconductor devices or of electronic integrated circuits)(2017-2500);machine tools for working any material by removal of material, operated by electro-chemical processes or electron beam, ion beam or plasma arc processes (excl. for soldering and welding machines, materials testing machines and machines for the manufacture of semiconductor devices or of electronic integrated circuits)(2007-2011);machine-tools for working any material by removal of material, operated by electro-chemical, electron beam, ionic-beam or plasma arc processes (excl. soldering and welding machines, incl. those which can be used for cutting, and material testing machines)(1988-1994)out84569010focused ion beam milling machines for producing or repairing masks and reticles for patterns on semiconductor devicesout84569020water-jet cutting machinesout84569030machine tools for dry etching, stripping or cleaning semiconductor wafersout84569090machine tools for working any material by removal of any material by electro-chemical processes or electron beam, ion beam or plasma arc processes (excl. for soldering and welding machines, materials testing machines, focused ion beam milling machines for producing or repairing masks and reticles for patterns on semiconductor devices, and machine tools for dry etching, stripping or cleaning semiconductor wafers)out
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