Odpowiedź referencyjnaKod HS/CN 381800 jest poza zakresem na potrzeby przygotowania EUDR.
Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion) Zaindeksowany silnik zakresu zwraca dla tego kodu wynik Out of scope. No Annex I scope match was found for this indexed CN code.
Podstawa zakresuDlaczego ta strona referencyjna daje taką odpowiedź.
- Opis kodu
- Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion)
- Podstawa w załączniku I
- Brak bezpośredniej pozycji w załączniku I
- Podstawa źródłowa
- Regulation (EU) 2023/1115 Annex I and CN 2026 index
Hierarchia CNWiersze nadrzędne, podrzędne i sąsiednie.
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38produkty chemiczne różnenarrower3818chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion)out38180010silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion)out38180011doped silicon wafers of a thickness <=200μm, rectangular, whether or not with cut or rounded corners "photovoltaic wafers"out38180019silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and "photovoltaic" rectangular wafers of a thickness <=200μm)out38180090chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon)out Wzorzec dowodowyCo to oznacza dla przygotowania.
Ten wiersz nie uruchamia bezpośrednio zbierania dowodów w bieżącym wyniku zakresu.