Kod HS/CN 38180019 jest poza zakresem na potrzeby przygotowania EUDR.
Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and "photovoltaic" rectangular wafers of a thickness <=200μm) Zaindeksowany silnik zakresu zwraca dla tego kodu wynik Out of scope. No Annex I scope match was found for this indexed CN code.
Dlaczego ta strona referencyjna daje taką odpowiedź.
- Opis kodu
- Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and "photovoltaic" rectangular wafers of a thickness <=200μm)
- Podstawa w załączniku I
- Brak bezpośredniej pozycji w załączniku I
- Podstawa źródłowa
- Regulation (EU) 2023/1115 Annex I and CN 2026 index
Wiersze nadrzędne, podrzędne i sąsiednie.
Widok biblioteki służy do nawigacji referencyjnej. Użyj weryfikatora, gdy chcesz uruchomić inny kod jako działanie.
38produkty chemiczne różnenarrower3818chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion)out381800chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion)out38180010silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion)out38180011doped silicon wafers of a thickness <=200μm, rectangular, whether or not with cut or rounded corners "photovoltaic wafers"out38180090chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon)out
Co to oznacza dla przygotowania.
Ten wiersz nie uruchamia bezpośrednio zbierania dowodów w bieżącym wyniku zakresu.
Regulation (EU) 2023/1115 Annex I — relevant productspobrano 2026-08-06Commission Delegated Regulation (EU) 2026/2102 amending Annex I to Regulation (EU) 2023/1115pobrano 2026-09-24Eurostat Comext Combined Nomenclature codelist (CXT_NC v11.0)pobrano 2026-08-06Eurostat Comext partner country codelist (CXT_FREE_ISO)pobrano 2026-08-06Eurostat Comext DS-045409 — EU trade since 1988 by HS2-4-6 and CN8pobrano 2026-08-06Commission Implementing Regulation (EU) 2025/1093 — country benchmarkingpobrano 2026-08-06Regulation (EU) 2025/2650 amending Regulation (EU) 2023/1115 as regards certain obligations of operators and traderspobrano 2025-12-26Commission Implementing Regulation (EU) 2026/1565 amending Implementing Regulation (EU) 2024/3084 (EUDR information system)pobrano 2026-08-08